๊ฐ€์ž… ํ›„ ์ดˆ๋Œ€ ๋งํฌ๋ฅผ ๊ณต์œ ํ•˜๋ฉด ๋™์˜์ƒ ์žฌ์ƒ ๋ฐ ์ดˆ๋Œ€ ๋ณด์ƒ์„ ๋ฐ›์„ ์ˆ˜ ์žˆ์Šต๋‹ˆ๋‹ค.

Dylan Patel
@dylan522p
SemiAnalysis AI Infrastructure Research and Consulting DMs are open for consulting, quotes, or to talk shop, Opinions my own
๊ฐ€์ž… April 2018
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I wanted to use this photo because it's the actual package and looks way cooler. The black area above is the DRAM but not milled yet. Cross section from our Hitachi XTEM coming soon ๐Ÿคซ
๋” ๋ณด๊ธฐ
We took the silicon out of the silicon. Quick turn from SemiAnalysis STEEL Teardown Lab: iPhone 18 Pro Max, A20 silicon on TSMC N2. more to follow...