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@harukaze5719
English/Korean | I'm not leaker nor tipster, Korean PC Tech Fan l Everything I post is personal opinion.
좋은 질문을 하기 위해, 조금 더 논리적인 생각을 구축하기 위해
가입 January 2019
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HPB seems really useful solution...
But, seems only Samsung is talking about it.
Because Samsung DRAM has low efficiency so that need that extra cooling solution?
Or, Hynix and Micron is prepaing other solution?
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Heat is a known issue in HBM, which makes this slide interesting from @SamsungSemiUS as a potential way to handle the increased thermal challenges.
I'm also intrigued on the notion that each cHBM base die will not be created equal and performance will likely vary.
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