kokycpcb(@pcbanalysis):From a tech roadmap perspective, here is how the materials are shifting: 1️⃣ Compute/Switch/Motherboards: CCL is staying on the current PPO/CH track, starting at M8+ and scaling toward M9/M10 for next-gen nodes. 2️⃣ Backplanes/Midplanes: To balance manufacturability and performance, we're seeing a hybrid approach. It leverages a glass-free PTFE Core paired with Q-glass/CH resin Prepregs (PP) for mechanical reinforcement. Co-existence is the actual winning playbook here. #AIInfrastructure #PCB #CCL #MaterialScience #PTFE #QGlass

2026.07.18 05:59

From a tech roadmap perspective, here is how the materials are shifting: 1️⃣ Compute/Switch/Motherboards: CCL is staying on the current PPO/CH track, starting at M8+ and scaling toward M9/M10 for next-gen nodes. 2️⃣ Backplanes/Midplanes: To balance manufacturability and performance, we're seeing a hybrid approach. It leverages a glass-free PTFE Core paired with Q-glass/CH resin Prepregs (PP) for mechanical reinforcement. Co-existence is the actual winning playbook here. #AIInfrastructure# #PCB# #CCL# #MaterialScience# #PTFE# #QGlass#

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