SemiVision 🇹🇼 👁️👁️(@semivision_tw):Samsung Electro-Mechanics × Qualcomm: Organic Bridge for AI Packaging Samsung Electro-Mechanics and Qualcomm are reportedly developing Organic Bridge technology for high-density interconnects between logic and HBM in AI/HPC packages. Unlike Intel’s EMIB, which uses an embedded silicon bridge, the approach integrates fine-pitch interconnects directly into the organic substrate, targeting lower cost and simpler processing. 2.5D → 2.1D L/S: 9/12 μm → 2/2 μm The key trend: organic substrates are moving closer to interposer-level interconnect density.

2026.09.21 10:01

Samsung Electro-Mechanics × Qualcomm: Organic Bridge for AI Packaging Samsung Electro-Mechanics and Qualcomm are reportedly developing Organic Bridge technology for high-density interconnects between logic and HBM in AI/HPC packages. Unlike Intel’s EMIB, which uses an embedded silicon bridge, the approach integrates fine-pitch interconnects directly into the organic substrate, targeting lower cost and simpler processing. 2.5D → 2.1D L/S: 9/12 μm → 2/2 μm The key trend: organic substrates are moving closer to interposer-level interconnect density.