DIGITIMES: Memory boom stays strong into 2027 DIGITIMES argues the memory upcycle is accelerating as AI infrastructure drives demand for DRAM, NAND and HBM, with supply remaining tight until meaningful new capacity starts arriving in 2027–2028 The biggest structural change is that memory demand is increasingly tied to AI accelerator architectures rather than PCs and smartphones. HBM4 adoption accelerates through 2026–27, followed by HBM4E, while Nvidia’s Vera platform moves toward removable SOCAMM2 LPDDR5X modules Enterprise storage is also benefiting. PCIe Gen6 enterprise SSDs are entering production, with Samsung and Micron already ramping products and Phison and Silicon Motion expected to launch Gen6 controllers in 2027 Capacity additions are substantial but mostly back-end loaded: · Samsung: Pyeongtaek P5 production in 2028, Yongin DRAM in 2029, new Onyang HBM packaging in 2029. · $SKHY: M15X already ramping in 2026, Yongin DRAM from Q1 2027, P&T7 HBM packaging by end-2027, Indiana HBM packaging in H2 2028. · $MU: Tungluo expansion, Hiroshima DRAM, Singapore HBM packaging from 2027, new NAND capacity in H2 2028, Idaho expansion in 2027–28 and New York DRAM from 2030.