According to Korean media, Microsoft, Google, Amazon and Meta are speeding up their in house AI chips. That could open up a SECOND group of HBM buyers beyond $NVDA. Microsoft's Maia 300 is expected to ship more than 1 MILLION units next year, according to Reuters as cited in the report. Each chip is said to pack eight HBM4 stacks totaling 288 GB. Google's next TPU and Amazon's Trainium3 are also pushing HBM capacity per chip higher. Counterpoint expects HBM bit demand from custom chips to rise about 35x from 2024 to 2028. SK Hynix already supplies HBM3E for Maia 200. Samsung wants a bigger piece of this custom chip wave, including foundry overflow if $TSM stays full. Less dependence on Nvidia does not mean less memory but rather means MORE HBM sockets. $MSFT $GOOGL $AMZN $META