Check out the latest blog, by Raghu Shankar, “Developing AI-native Automated Virtual Chiplet Eco-systems: Shift Left, Shift Up, and Shift Out to accelerate Chiplet adoption.” Key Takeaways: · SIPs with 2.5D and 3D chiplets deliver 10x functionality, modular dies, higher yields, lower cost, and cross-generation reusability. · Chiplet adoption needs clear value proposition, demand sizing, and vendor profitability proof to justify supply-side investments across products and generations. · Shift left: Move evaluation to planning and design space exploration for early PPAC estimates, lowering risk, cost, and time to decision. · Shift up: Focus at the architecture layer, abstract physical and protocol details, use HLS synthesis, simulation, emulation, and prototyping. · Shift out: Expand pool of buyers and sellers to maximize explorations. · Develop AI native virtual ecosystem: Automate chiplet interop testing with virtual prototyping. Read the full story here: And attend the panel session on this topic at the OCP Global Summit as part of the Server/Open Chiplet Economy track on October 15, 2026 in San Jose, CA. Learn more and register here: