Korean media reported that Micron plans to add 60,000 wafers per month of HBM capacity by the end of this year, raising its total capacity to around 100,000 wafers per month.
This marks an aggressive expansion that nearly doubles last year's capacity level of 40,000 to 50,000 wafers per month within a short span of time.
With SK Hynix's HBM capacity expected to reach 200,000 wafers per month and Samsung's 250,000 wafers per month by the end of this year, Micron's expansion is the most aggressive in scale among the three companies.
The industry expects Micron's HBM4 12-High product mix to rise from 20 to 30 percent of its total HBM output in early this year to as much as 50 percent by the end of the year.
显示更多
