Daniel Romero(@HyperTechInvest):FOPLP is coming, and here are the plans for the major advanced packaging providers: · Powertech (PTI): 510 × 515 mm. Ramp-up: 2027 · $ASX: 310 × 310 mm. Ramp-up: 2027 · $TSM: 310 × 310 mm. Ramp-up: 2028 · Samsung: 415 × 510 mm. Ramp-up: 2028 · Rapidus: 600 × 600 mm. Ramp-up: 2029 · $AMKR: 650 × 650 mm. Ramp-up: 2028

Daniel Romero

@HyperTechInvest

Analyst. Semiconductors, data centers & physical AI. Portfolio and investment theses on Substack Join 14,000+ readers:

加入 April 2024

336 正在關注 46.4K 粉絲

Daniel Romero@HyperTechInvest

2026.09.14 18:58

FOPLP is coming, and here are the plans for the major advanced packaging providers: · Powertech (PTI): 510 × 515 mm. Ramp-up: 2027 · $ASX: 310 × 310 mm. Ramp-up: 2027 · $TSM: 310 × 310 mm. Ramp-up: 2028 · Samsung: 415 × 510 mm. Ramp-up: 2028 · Rapidus: 600 × 600 mm. Ramp-up: 2029 · $AMKR: 650 × 650 mm. Ramp-up: 2028 · $INTC: 510/515 mm-class. Ramp-up: 2029