註冊並分享邀請連結,可獲得影片播放與邀請獎勵。

Daniel Romero
@HyperTechInvest
Analyst. Semiconductors, data centers & physical AI. Portfolio and investment theses on Substack Join 14,000+ readers:
加入 April 2024
348 正在關注    47.1K 粉絲
ASIC Shipments to Surpass GPUs in 2027 DIGITIMES expects ASIC shipments to surpass GPUs in 2027, driven by $GOOG, $AMZN, and Huawei, while Nvidia and Google emerge as the two dominant forces in high-end AI accelerators As $TSM, $ASX, and Amkor expand advanced packaging capacity, the main supply constraints are shifting toward ABF substrates, T-glass, high-layer-count PCBs, and HBM ABF substrates and T-glass are expected to remain in shortage through 2027–2028, prompting major capacity expansions from Ibiden, Unimicron, Kinsus, SEMCO, Shinko, Nittobo, and others PCB requirements are also becoming far more demanding, with AI server boards moving from 12–20 layers toward 40–50 layers, while new capacity can take 2–3 years to build and qualify The result is a supply-chain race in which AI accelerator companies increasingly need to secure capacity early, qualify new suppliers, or directly invest in their supply chains
顯示更多
0
11
62
10
轉發到社區