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Daniel Romero
@HyperTechInvest
Analyst. Semiconductors, data centers & physical AI. Portfolio and investment theses on Substack Join 14,000+ readers:
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Glass Substrates Are Progressing Faster Than Ever Lately, it's SEMCO that's been pushing commercialization forward SEMCO has just completed initial reliability testing of its 100 × 100 mm glass substrates and moved to package-level testing using actual customer chips The company is working with several major global customers SEMCO targets an operational production line by late 2027 and full-scale manufacturing in 2028 Previous TGV reliability issues delayed equipment orders, making successful package-level validation a critical milestone It's strongly rumored that $LPK played a key role in resolving these issues, with improvements coming primarily from the development of thicker glass substrates
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