Omer Cheema(@Omercheema):Semiconductor equipment subsystem lead times: Deposition-equipment component lead times ~4 → up to 10 months. Laser-process Japanese parts up to 40 months, no premium pulls them forward. Packaging-tool components lead times up +~50%. Fab tool deliveries ~2×. Drag already flagged on Samsung Pyeongtaek and SK Yongin.

Omer Cheema

@Omercheema

Semicon expert. Ex AMD, Ex Samsung. Now at Renesas. PhD Paris Tech. MBA from INSEAD. Opinions my own.

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Omer Cheema@Omercheema

2026.09.17 20:34

Semiconductor equipment subsystem lead times: Deposition-equipment component lead times ~4 → up to 10 months. Laser-process Japanese parts up to 40 months, no premium pulls them forward. Packaging-tool components lead times up +~50%. Fab tool deliveries ~2×. Drag already flagged on Samsung Pyeongtaek and SK Yongin.