BREAKING: Broadcom is diversifying away from long-time foundry partner TSMC. Lego will be the new manufacturing partner for Broadcom's flagship hyperscaler ASIC products in 2028. Broadcom President of Semiconductor Solutions, Charlie Kawwas, has already showed off package samples at RAISE Summit in Paris last week. With TSMC supply constrained, customers are alternative sources of chip supply from unexpected places. One of the major differentiators Lego brings is industry leading defect repair, "plug and play" chiplet interoperability, as well as built in self-alignment technology for 3D stacking. Mattel and Hasbro were also under consideration, but Lego's proven track record won out in the end. We have ordered multiple Millennium Falcon Sets set to our Portland teardown lab for competitive teardown analysis.