$MU $SKHY Memory Innovation Is Just Getting Started. 3D DRAM Incoming. "SK hynix is reportedly stepping up development of 3D $DRAM, a next-generation memory technology for on-device AI. … the company has reportedly begun recruiting 3D-Stacked DRAM-on-Logic Design Engineers through its U.S. subsidiary in San Jose, California. SK hynix is also said to have partnered with a specific customer to develop applications for the technology.” “SK hynix President and Chief Development Officer (CDO) Hyun Ahn said AI development is increasingly constrained by memory bottlenecks, requiring new memory architectures beyond incremental improvements. He said the company is working with TSMC to apply its advanced logic process to HBM4 base dies, with plans to expand the technology to High Bandwidth Flash (HBF) and 3D-Stacked DRAM-on-Logic to further integrate memory and logic for higher performance and power efficiency.” It's not just SK Hynix. I've talked to my buddies in the industry. Micron and Samsung are actively R&Ding on 3D DRAM. This product is going to be perfect for AI Inference.