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Chon Tang
@chontang
Berkeley/MIT. Former quant, always entrepreneur. VC launching startups at UC Berkeley @skydeck_cal, Silicon Valley’s global accelerator. Opinions mine!
加入 June 2009
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Haha yea - the Huawei approach really is kinda like warmholes (wait until the journalists get a hold of that comparison). Just like warmholes connect two 3D points in a 4th dimension and dramatically reduce travel time, Huawei's approach does that in 2D/3D. No, this isn't the same thing as memory stacking (although there are similarities when it comes to bonding technology) - they have to be able to very precisely align many many tiny traces between the two layers (create the warmholes!!) for this to work.
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