StatementDog | AI & Tech Supply Chains(@statementdog):Chip-packaging bottlenecks are spreading beyond AI, GF Securities says. Its supply-chain checks point to tight packaging capacity for analog chips, with lead times up more than 30% and unfilled orders rising. GF expects prices for flip-chip, wire-bond and QFN packaging to rise 10% to 80% in H2 2026, with increases of 10% to 20% for CoWoS. Taiwan’s Economic Daily News reported on Oct. 13 that OSAT prices had already risen 10% to 30%. For ASE Technology $ASX, GF expects leading-edge advanced packaging to account for 32% of packaging and testing revenue in 2027, up from 23% in 2026. The firm raised its price target to NT$843 from NT$754.

StatementDog | AI & Tech Supply Chains@statementdog

2026.10.20 16:44

Chip-packaging bottlenecks are spreading beyond AI, GF Securities says. Its supply-chain checks point to tight packaging capacity for analog chips, with lead times up more than 30% and unfilled orders rising. GF expects prices for flip-chip, wire-bond and QFN packaging to rise 10% to 80% in H2 2026, with increases of 10% to 20% for CoWoS. Taiwan’s Economic Daily News reported on Oct. 13 that OSAT prices had already risen 10% to 30%. For ASE Technology $ASX, GF expects leading-edge advanced packaging to account for 32% of packaging and testing revenue in 2027, up from 23% in 2026. The firm raised its price target to NT$843 from NT$754.