Tech Fund(@techfund1):Goldman: TSMC accelerating capacity buildout We now expect N3/N2 wafer-out capacity to reach 200kwpm/140kwpm by end-2027E (vs. 190kwpm/130kwpm prior), as we see stronger demand from customers especially for AI/HPC applications. On the back-end, we also raise our 2027E CoWoS (incl. WMCM) capacity to 280kwpm (vs. 250kwpm prior). As a result, we lift our 2027E capex to US$78bn (vs. US$70bn prior).

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2026.07.10 07:41

Goldman: TSMC accelerating capacity buildout We now expect N3/N2 wafer-out capacity to reach 200kwpm/140kwpm by end-2027E (vs. 190kwpm/130kwpm prior), as we see stronger demand from customers especially for AI/HPC applications. On the back-end, we also raise our 2027E CoWoS (incl. WMCM) capacity to 280kwpm (vs. 250kwpm prior). As a result, we lift our 2027E capex to US$78bn (vs. US$70bn prior).