Wall St Engine(@wallstengine):APPLIED MATERIALS, INTEL TO CO-DEVELOP NEXT-GEN AI CHIP TECHNOLOGY $AMAT and $INTC are expanding their R&D partnership to develop next-generation transistors, interconnects and advanced packaging for AI chips. The work will span Applied’s new EPIC Center and Intel’s Oregon R&D campus, including development around Intel’s Foveros 3D stacking technology, with the goal of moving new AI-focused semiconductor technologies into high-volume manufacturing faster.

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Wall St Engine@wallstengine

2026.10.06 13:03

APPLIED MATERIALS, INTEL TO CO-DEVELOP NEXT-GEN AI CHIP TECHNOLOGY $AMAT and $INTC are expanding their R&D partnership to develop next-generation transistors, interconnects and advanced packaging for AI chips. The work will span Applied’s new EPIC Center and Intel’s Oregon R&D campus, including development around Intel’s Foveros 3D stacking technology, with the goal of moving new AI-focused semiconductor technologies into high-volume manufacturing faster.