Zephyr
@zephyr_z9
AI & Chips | Not Investment Advice | DYOD
加入 August 2023
762 正在關注 168.9K 粉絲
I'm very excited about the Feynman design
Hybrid Bonding FTW
"We expect the shift to 3D for Nvidia Feynman, AWS Trainium, and Google V9 (Broadcom).
Capacity Surge: We forecast TSMC SoIC capacity to be 15KPM and 35KPM by end of 2026 and 2027."
Music to my ears
