TSMC Holds at Microbumps for HBM, Deferring Hybrid Bonding CapEx
Vik: I am bearish hybrid bonding at least for HBM applications. High stacks are too expensive, and hardware makers won’t bite into it.
Broadcom’s AI Chip Forecast Clouds Over Google Defection Fears
Vik: OpenAI’s Jalapeno’s quick turnaround is actually testament to Broadcom’s ASIC design prowess, come to think of it.
Austin: Second-sourcing and CoT are price negotiations; no one in the race to deploy inference compute is walking away from Broadcom.
Daily Update - September 3rd, 2026
- Nvidia acquires Hugging Face for $12.93B
- Broadcom AI chip forecast clouds over Google
- TSMC holds at microbumps for HBM
- Samsung pushes HBM into vertical territory
- Phison warns 2027 NAND shortage worst ever