Samsung aims to complete development of 3D Cube-H, its hybrid bonding technology for 3D logic chips, by early next year, according to Korean media reports.
The technology is primarily intended for ultra-high-performance AI chips. Korean media said that if Samsung succeeds, it could strengthen its competitive position in next-generation AI chips and lay the groundwork for winning Big Tech customers for its foundry business.
Bayer aims to develop gene-edited grains that tap nitrogen from the air, reducing reliance on costly fertilizers vulnerable to Middle East supply disruptions
SpaceX aims to secure a minimum of 80,000 cell sites across the US, and it’s in talks with at least one major cellular infrastructure company to reach that goal