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Samsung Electronics signed a strategic MOU with Broadcom at the AI Summit in San Francisco to jointly develop next-generation HBM-based AI accelerators. The partnership covers memory and foundry cooperation valued at more than $200 billion through 2030. Samsung will supply HBM (including custom HBM) for Broadcom’s AI accelerators and produce Broadcom chips on 2nm-and-below processes, while also providing advanced packaging and pursuing system-technology co-optimization (STCO).
Apple announced a $30 billion deal with longtime supplier Broadcom to source chips through 2031, expanding US-based manufacturing at a Colorado factory as the Trump administration pushes for greater domestic chip production
We've signed an agreement with Google and Broadcom for multiple gigawatts of next-generation TPU capacity, coming online starting in 2027, to train and serve frontier Claude models.
Samsung Electronics won a contract worth more than $200 billion to make chips for Broadcom $AVGO
The pact, to run for five years through 2030, will focus on Samsung’s 2-nanometer and below process technologies for Broadcom’s products - Bloomberg
Wall Street's main indexes ended higher, with Broadcom and other chip stocks rallying as investors bought shares in companies related to AI that are expected to drive a strong second-quarter earnings season