Tackling #GlobalDev# challenges to create a #LivablePlanet# will require dynamic new partnerships between govts & non-state actors, including: ➡️ civil society ➡️ private sector ➡️ social entrepreneurs ➡️ impact investors Explore how we could do so:

Are you on LinkedIn? Follow us to stay updated with the latest on social accountability, global development, and impactful partnerships. 🔗 #SocialAccountability# #GlobalDevelopment# #GPSA# #LinkedIn# #FollowUs#

New shipments of solar lighting products are heading to global customers. Reliable production, quality inspection & on-time delivery for every order. 📞 +86 18933439494 #zhongshanpuchuanglighting# #solarlighting# #shipment# #globaldelivery# #solarstreetlight# #solarfloodlight#

🤝 #CIVIC# aims to build lasting connections between civil society & the @WorldBank, fostering inclusive, transparent, and effective solutions. Exciting times ahead for global dev.! Learn more in the recording of our previous event: #SocialAccountability#

🗓️ 98 days to APEC and Shenzhen is glowing. From above, the city at night looks like a grid of light pressed against the South China Sea. Towers rise like a stage waiting for its audience. The world is coming. Shenzhen is ready. 🌃✨ 📍 Shenzhen 👉 #Shenzhen# #APEC# #APEC2026# #Countdown# #CityLights# #NightView# #Guangdong# #China# #GlobalEvent# #Leadership# #Skyline# #Ready#

🎉 APEC countdown: 100 days to go Guangzhou Tower lit up with "APEC CHINA 2026" on August 10 to mark the 100-day countdown to the APEC Economic Leaders' Meeting to be held on November 18–19 in Shenzhen. Guangzhou is ready to welcome leaders from the member economies. 🌏✨ 📍 Guangzhou Tower, Guangzhou #APEC# #APEC2026# #Shenzhen# #Guangzhou# #Countdown# #AsiaPacific# #Diplomacy# #Guangdong# #China# #100Days# #Leadership# #GlobalEvent#

On Tuesday at the @GlobalSemi US Executive Forum in Menlo Park, I moderated "Silicon at the Breaking Point: Designing Chips for a World That Can't Wait" with @SamsungDSGlobal President Paul Cho, @AMD CTO Mark Papermaster, @Broadcom Semiconductor Solutions Group President Charlie Kawwas and @OpenAI VP of Hardware Richard Ho. The lead-in was that the transistor is no longer the bottleneck. Power, memory bandwidth and packaging are. I opened with that, and not one of the four pushed back. Each built on it from his first answer. On custom silicon: Richard framed OpenAI's XPU as a full-stack bet on intelligence per watt for a known set of workloads, not a bet against merchant GPUs. The unit of purchase is now the fleet across multiple campuses, not the chip or the rack. I said years ago that 75+% design margins would push the biggest buyers to find another path. They found it. Charlie's outlook is single campuses of 5 to 10 gigawatts by 2031. On power: Mark's line was that power is performance, and data movement is where most of it goes. Chiplets were a power decision at AMD before anything else. Thermal and cooling are now job one. On AI in the design loop: Richard said AI compressed OpenAI's design cycle more than his team expected, and the point is to make engineers faster, not to replace them. Mark's rule at AMD is that agentic AI runs the design space exploration no human could do by hand, and accountability stays with the human engineer. I agree with both. On packaging: Charlie called the substrate the choke point for the next five years, which is why Broadcom is going into substrate production itself. On the OpenAI program, Broadcom's tape-out went from 15 to 18 months to nine. His math: that cadence is an extra generation every three years, and in AI that is the whole game. On memory: Paul had the stat of the night. By his numbers, compute is up roughly 60,000x in 20 years and memory bandwidth roughly 100x. Design memory first and bring the memory partner into architecture, not procurement. He also said supply chain resilience is now a design input decided at architecture definition, and that Samsung's Taylor, Texas fab goes to customer mass production in 2027. The node still delivers, at a price. The advantage now goes to whoever co-designs compute, memory, packaging, networking and power from day one. That is structural, not a phase. $AMD $AVGO Thanks to all four for the candor, and to the GSA team led by Jodi Shelton and Cherie Britt at Samsung for pulling it together. Several points are worth putting on the record.