#HighNAEUV#: TSMC will start using it in 2030 — and C.C. Wei says adopting it later than rivals is no disadvantage From TSMC's 3Q26 #EarningsWatch# call (10/15), the High NA EUV exchange in the speakers' own words: 🔹 Q (Krish Sankar, TD Cowen): "You did touch upon it, the High NA agreement with ASML from 2030 onwards. I'm just curious, historically, TSMC was more ahead of the curve with the EUV adoption. It looks like by the time you adopt High NA EUV, it would be 2030, 2031, but some of your competitors would already be using it by then. So do you see that as a disadvantage, or you're not worried about competition getting ahead with High NA EUV?" 🔹 A (C.C. Wei, Chairman & CEO, TSMC): "We always evaluate a new tool, and if we want to put it into the mass production, it got to be the best technology with a very reasonable cost, and most important is the best maturity. Okay, so we say in 2030 we'll start to use it because we also think at that time, High NA will be mature, and we are also working very closely with ASML to establish a 12-inch photomask by 2031. And at that time, we think that High NA's cost will be reasonable and for TSMC to make it into the mass production." 🔹 C.C. Wei: "And this is a very good tool, let me emphasize that. And in the smaller geometry, it definitely has some advantage. Whether that our technology, because we are using it later than our competitor, so disadvantage to TSMC? No, because we have confidence that we are still the best company to offer the most advanced technology to our customers." 💡More: 🔗 $TSM $ASML $INTC