NEWS
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Live insights on semi and AI, tailored for global investors and industry players. Hosted by @trendforce, streaming weekdays and available on LinkedIn and FB.
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#SKhynix# targets from 13 Korean brokers span KRW 2.64M–4M post-3Q26; Yuanta raised to KRW 3.7M, sees 4Q26 OP of KRW 118.2T as #HBM4# overtakes HBM3E—IBK cut to KRW 3.2M on the share-price gap, not the #Memory# outlook.💡More: 🔗
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#AppliedMaterials# is doubling down on #hybridbonding#, planning to raise its stake in #BESI# from 9% to 20%. The Dutch firm reportedly holds around 70% of the global hybrid bonding equipment market.💡More: 🔗
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A shift by one of the world’s biggest HBM buyers could ripple across the memory market. #NVIDIA# is reportedly reconsidering 12-Hi HBM4E for Rubin Ultra in favor of a mix of 8-Hi #HBM4# and HBM4E, potentially easing costs and supply constraints.💡More: 🔗
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🚀 #MicroLED# optical interconnects are gaining traction in AI infrastructure! U.S. smart glasses maker Vuzix showcased its Causeway waveguide platform at OCP, supporting Micro LED and VCSEL light sources for high-density optical connections.💡More: 🔗
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Another price hike in the works? #TSMC# is reportedly eyeing a 20% jump in #CoWoS# prices, on top of planned foundry price increases, as AI GPUs, server CPUs, and custom ASICs fuel a fresh surge in advanced packaging demand.💡More: 🔗
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A new breakthrough in fourth-generation semiconductors? China’s Jiachi Power Technology claims a world-first vertical gallium oxide MOSFET, delivering over 1 A of on-state current and 900 V breakdown voltage—setting multiple performance records.💡More: 🔗
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A 2,330% profit surge! Chinese #SiC# firm SICC, a rival to global players like Wolfspeed, saw net profit jump to CNY 27.22M in 9M26, fueled by demand for automotive-grade conductive substrates as EV makers accelerate the shift to 800V platforms.💡More: 🔗
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With Samsung projecting a nearly 800% YoY surge in 3Q26 operating profit to KRW 107T, all eyes are on #SKhynix#, whose earnings are tipped to approach a record KRW 77T. But can its #HBM4# ramp-up meet expectations and deliver the next profit boost?💡More: 🔗
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#Micron# and #Samsung# both stack #HBM# directly on processors: Micron's #vHBM# keeps a base die and targets 2028, while Samsung's zHBM drops the 2.5D interposer, with commercialization eyed for about 2029 and as early as 2028. 💡More: 🔗 $MU $SSNLF
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#Micron# says #AI# cut data center #SSD# controller design time by 50% and product development time by 60% vs. the prior generation, and plans $10B over the next decade for Micron Research Labs, its first dedicated U.S. memory research hub. 💡More: 🔗 $MU
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#Intel# CTO Pushkar Ranade said on the Dwarkesh Podcast that Intel has already caught up with #TSMC# if the measure is #technology# alone, while scale will take longer; global tools allow roughly 2x more leading-edge output, not 10x.💡More: 🔗 $INTC $TSM
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#Micron# targets 2028 for #vHBM#, which stacks #HBM# directly on processors, with vHBM 1/2/3 slated for 2028/29/30 alongside HBM5/5E/6. HBM4 delivers 2.8 TB/s per stack, and vEIM 1 aims for 2 TB/s at under 1 pJ/bit. 💡More: 🔗 $MU
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#Micron# has studied 4F² #DRAM# for 20+ years and still skips it, saying the density edge is near-mythical and capacitor pitch sets bit density. #CXMT# (Oct. 10) and #Samsung# (CTO, Oct. 14) are pursuing it, while Micron ramps 1δ in 2H27. 💡More: 🔗 $MU $SSNLF
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#Amazon# says #AWS# large-scale compute capacity is fully booked for 2026, most of 2027 is sold out and a considerable share of 2028 is committed; CEO Andy Jassy does not expect #Memory# and power shortages to end in 2027.💡More: 🔗 $AMZN
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#Infineon# and #NVIDIA# are expanding their collaboration on #GaN-based# power solutions for 800V DC AI data centers, paving the way for 1 MW+ racks as NVIDIA targets adoption from 2027!💡More: 🔗
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South Korea’s LX Semicon is putting 60+ patents tied to #SiC# power semiconductors and epitaxial wafers on the market, signaling a retreat from the sector. With EV demand stuck in the slow lane, pressure is mounting across the SiC sector.💡More: 🔗
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Rising memory prices and tight foundry capacity boosted #PSMC’s# Q3 revenue by 80% YoY and net profit by 338%, with further 10–20% mature-node price hikes planned for 2027.💡More: 🔗
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#Tesla# is reportedly putting KRW 1.1T on the table for AI chip substrates! The deal would lock in Samsung Electro-Mechanics’ FC-BGA supply through 2033, and #NVIDIA# is said to be grabbing capacity too. 💡More: 🔗
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#NVIDIA#'s #GTCBerlin# keynote spotlights the supply chain: 17 DSX POD partners incl. Delta, Gigabyte, Pegatron, Wistron, plus 6 capacity suppliers (Unimicron, IBIDEN, SEM, Amkor, KYEC, SPIL). 💡More: 🔗 $NVDA $TSM $AMKR
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#NVIDIA-linked# #Groq# is reportedly exploring 3D-stacked DRAM for its next-gen AI chips, potentially moving beyond #SRAM# as AI models grow larger. Could this reshape AI inference chip design? 💡More: 🔗
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