From a tech roadmap perspective, here is how the materials are shifting:
1️⃣ Compute/Switch/Motherboards: CCL is staying on the current PPO/CH track, starting at M8+ and scaling toward M9/M10 for next-gen nodes.
2️⃣ Backplanes/Midplanes: To balance manufacturability and performance, we're seeing a hybrid approach. It leverages a glass-free PTFE Core paired with Q-glass/CH resin Prepregs (PP) for mechanical reinforcement.
Co-existence is the actual winning playbook here.
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