Sam Altman told Samsung executives AI demand has been "double counted" amid neocloud bubble concerns. He said only OpenAI and Anthropic drive major demand growth, warning of supply shocks and turbulence, but expects AI demand to surge long term. Source: fnnews h/t @jukan05

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Samsung aims to complete development of 3D Cube-H, its hybrid bonding technology for 3D logic chips, by early next year, according to Korean media reports. The technology is primarily intended for ultra-high-performance AI chips. Korean media said that if Samsung succeeds, it could strengthen its competitive position in next-generation AI chips and lay the groundwork for winning Big Tech customers for its foundry business.

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