TSMC is working hard to maintain its lead over Samsung and Intel, media report, by already preparing for 1nm production at Fab 20 in the Hsinchu Science Park with a 4-phase project (each phase is a new production line). -Fab 20 the vital sub-2nm fab. Phase 1 (P1) and P2 will do 2nm, P3 will do 2nm and A14, with room in P4 for A10 (1nm). The project is already in the hands of its R&D ‘One Team’. -Fab 18 P9 (Tainan) will do 2nm back-end and 3/5nm TSV, with equipment move-in in Q1 2027 and scale up to 25,000 wafers-per-month (wpm) -Fab 22 (Kaohsiung) main 2nm fab, 6 phases. P1 & P2 each 25,000wpm, P3 just started equipment move-in for 2nm, A16; P4 under construction, for N2, A16. -Fab 22 (STSP) P7 construction to start early-2027, will do 2nm and below processes. Has reserved space for future P8 and P9. -Fab 25 (CTSP, Taichung) will host 4-phases for A14, A13, A12 processes, with P1 already under construction, with P2 construction to begin soon, and P3 & P4 already in planning. In advanced packaging: -AP6 plant is expected to reach 10,000 wafers per month capacity by the 3rd quarter, and ramp up phase 3 for CoWoS, SoIC and InFO as well. (Hsinchu) -AP5B plant construction nearly finished, will focus on CoWoS (Taichung) -AP7 plant will be TSMC’s biggest advanced packaging campus, with P1 already packaging Apple chips with WMCM (Wafer-Level Multi-Chip Module) P2 nearly done, with equipment move-in in July, for SoIC for Nvidia. Planning for P3-P7 already underway and will support SoIC and CoPoS. (Chiayi) -AP8 will do CoWoS, with monthly capacity to exceed 40,000 wafers by end-2026, and planning for P2, P3 already started. (Tainan) $TSM $INTC $SSNLF #semiconductors# #semiconductor#

Taiwan memory module makers are rushing to secure cash to boost inventory levels of chips and materials due to the AI boom and rising prices, media report: -ADATA has raised NT$14 billion (US$440 million) through a convertible bond and syndicated bank loan, and is planning a 30 million private share placement -GoldKey Technology has raised NT$4.5 billion via convertible bond and syndicated loan -Apacer NT$1 billion convertible bond -Team Group NT$2 billion convertible bond -Innodisk, Transcend: each planning NT$3 billion convertible bonds -Silicon Power: planning NT$500 million convertible bond $SSNLF $HXSCL $MU #semiconductors# #semiconductor#

Taiwan’s representative to the U.S., Ambassador Alexander Yui, says there is no planned call yet between President Trump and Taiwanese President Lai Ching-te, but he suggests Trump may have only heard “the Chinese story” about Taiwan during his trip to Beijing. “If he has time, would love to tell him our side of the story, the Taiwan story, which is one of resiliency, of a state staying up against the Chinese aggression,” Amb. Yui tells @margbrennan. “The communication between Taiwan and the U.S. is constant, it's current. But I'll leave it to the U.S. to announce anything, if it happens.”

Taiwan thanked the U.S. on Friday for expressing its support and commitment to peace and stability and for reaffirming its Taiwan policy has not changed, ahead of the second day of President Donald Trump's state visit to China.