At SEMICON Taiwan’s imec Technology Forum, memory architecture and 3D integration emerged as closely connected parts of this challenge. Gouri Sankar Kar examined next-generation memory hierarchies for edge, physical, and agentic AI, while Zsolt Tőkei addressed the interconnect and integration technologies needed for future computing systems. A common direction was clear: select memory according to how data is used, then connect it vertically at the density and proximity the workload requires.