SemiVision 🇹🇼 👁️👁️(@semivision_tw):At SEMICON Taiwan’s imec Technology Forum, memory architecture and 3D integration emerged as closely connected parts of this challenge. Gouri Sankar Kar examined next-generation memory hierarchies for edge, physical, and agentic AI, while Zsolt Tőkei addressed the interconnect and integration technologies needed for future computing systems. A common direction was clear: select memory according to how data is used, then connect it vertically at the density and proximity the workload requires.

SemiVision 🇹🇼 👁️👁️

@semivision_tw

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SemiVision 🇹🇼 👁️👁️@semivision_tw

2026.10.08 03:50

At SEMICON Taiwan’s imec Technology Forum, memory architecture and 3D integration emerged as closely connected parts of this challenge. Gouri Sankar Kar examined next-generation memory hierarchies for edge, physical, and agentic AI, while Zsolt Tőkei addressed the interconnect and integration technologies needed for future computing systems. A common direction was clear: select memory according to how data is used, then connect it vertically at the density and proximity the workload requires.