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These 10 must-know AI stats reveal how dealerships and OEMs are leveraging AI to boost sales, improve customer satisfaction, reduce costs, and stay competitive in a rapidly evolving market. #Automotive# #AI# #AutoTech#
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Reach diverse buyers with DaveAI’s multilingual AI, increasing engagement in USA and UAE automotive dealership markets. Schedule your demo today: #ai# #autotech# #automotivedealerships# #autobot# #aiagents# #usa# #uae#
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Meet the DaveAI team at H13 - D35.6 from 13-17th October at GITEX Global 2025 in Dubai 🇦🇪 and experience how DaveAI's Autobot helps dealerships: #automotive# #AutoTech# #GITEXGlobal# #Gitex2025# @GITEX_GLOBAL #UAE# #Dubai#
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Noe Chico always loved working on cars, but put an auto career on hold once he became a father. When his daughter was 15, he went back to school to make his dream a reality. Noe’s story is a great example of why Ford Philanthropy partnered with @TechForceFound to offer scholarships that help people pursue a career. Since 2023, Ford Philanthropy & @Ford Dealers have supported 2,200 Auto Tech Scholars, including Noe. Noe's daughter is 18 now, old enough to watch her father head out for night class & understand exactly what he's building toward: a shop of his own, someday, with his name on it. Read more about Noe’s story here:
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$NVDA IS PUSHING GLASS SUBSTRATES TO EXTREME THICKNESSES According to Korean semiconductor publication KIPOST, NVIDIA is requesting glass substrates with a thickness of 2,000 µm (2 mm), potentially driving the adoption of new metallization technologies, including atomic layer deposition (ALD). As AI packages grow larger to accommodate more GPUs and HBM, substrate rigidity becomes increasingly important. Thicker glass improves mechanical stability and reduces warpage, but makes through-glass vias (TGVs) harder to manufacture. For perspective, a 2 mm substrate with 50 µm vias would have an aspect ratio of 40:1. Conventional sputtering struggles to deposit uniform conductive seed layers inside such deep, narrow holes. ALD's superior conformality could provide a solution. However, ALD isn't the only competing technology. In September, TRUMPF announced its HiPIMS technology for coating deep TGV structures, using highly ionized plasma to improve coverage. Meanwhile, MKS Atotech introduced a wet metallization process combining electroless copper seeding with advanced electroplating. Progress is also being made in drilling. Korean equipment manufacturer Philoptics demonstrated TGV processing on 2 mm-thick, 510 × 515 mm glass panels, claiming zero defective holes in its demonstration.
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