Interesting seeing more discussion around digital twins lately. The challenge is not only simulating environments. It’s maintaining reliable state across constantly changing systems and sensor inputs. Sertn’s verification layer helps preserve a consistent record of what systems observed and produced in real time.

Interesting. According to FundaAI, Qualcomm is expected to begin shipping an LPU-like AI ASIC to a Chinese CSP by the end of 2026. Estimated shipment volume is around 1 million units, with an ASP of roughly $4,000. For general-purpose server CPUs, shipments are expected to begin in the second half of 2027, or toward the end of 2027. 3 million units… that’s a lot. Qualcomm is also reportedly working with two U.S. CSPs. $QCOM

Interesting. According to Mizuho, as NVIDIA changed the cooling material for Rubin, the performance of liquid-metal TIM2 became unstable. As a result, NVIDIA redesigned the cold plate module and reverted back to Griffin. In other words, Rubin’s cooling module design appears to have shifted back toward a more conservative approach. This makes me wonder whether it can still handle Rubin’s massive TDP.

Interesting setup: Brazil small caps vs. large caps. We’re likely sitting near the lower bound of a long-term upward channel. This is the phase when pullbacks become a synonym for opportunity.