I’d like to share that I’ll be leaving Bandai Namco at the end of 2025. With the TEKKEN series reaching its 30th anniversary—an important milestone for a project I’ve devoted much of my life to—I felt this was the most fitting moment to bring one chapter to a close. My roots lie in the days when I supported small local tournaments in Japanese arcades and in small halls and community centers overseas. I still remember carrying arcade cabinets by myself, encouraging people to “Please try TEKKEN,” and directly facing the players right in front of me. The conversations and atmosphere we shared in those places became the core of who I am as a developer and game creator. Even as the times changed, those experiences have remained at the center of my identity. And even after the tournament scene grew much larger, many of you continued to treat me like an old friend—challenging me at venues, inviting me out for drinks at bars. Those memories are also deeply precious to me. In recent years, I experienced the loss of several close friends in my personal life, and in my professional life I witnessed the retirement or passing of many senior colleagues whom I deeply respect. Those accumulated events made me reflect on the “time I have left as a creator.” During that period, I sought advice from Ken Kutaragi—whom I respect as though he were another father—and received invaluable encouragement and guidance. His words quietly supported me in making this decision. Over the past four to five years, I’ve gradually handed over all of my responsibilities, as well as the stories and worldbuilding I oversaw, to the team, bringing me to the present day. Looking back, I was fortunate to work on an extraordinary variety of projects—VR titles (such as Summer Lesson), Pokkén Tournament, the SoulCalibur series, and many others, both inside and outside the company. Each project was full of new discoveries and learning, and every one of them became an irreplaceable experience for me. To everyone who has supported me, to communities around the world, and to all the colleagues who have walked alongside me for so many years, I offer my deepest gratitude. I’ll share more about my next steps at a later date. Thank you very much for everything. 【Postscript】 Although I will be leaving the company at the end of 2025, Bandai Namco has asked me to appear at the TWT Finals at the end of January 2026, so I expect to attend as a guest. For 30 years I kept saying, “I’ll do it someday,” and never once performed as a DJ at a tournament event. So instead, I will be releasing—for the first and last time—a 60-minute TEKKEN DJ-style nonstop mix (DJ mix), personally edited by myself, together with this announcement. Listening to it brings back many memories. Thank you again, sincerely, for all these years. ‘TEKKEN: A 30-Year Journey – Harada’s Final Mix’ by Katsuhiro Harada 1 is on #SoundCloud# December 8, 2025 - The Final Day of TEKKEN’s 30th Anniversary - Katsuhiro Harada [日本語版 (Japanese version)] このたび、2025年末をもちまして、私はバンダイナムコを退職することにいたしました。 長く携わってきた『鉄拳』シリーズが30周年という大きな節目を迎え、ひとつの区切りとして最もふさわしい時期であると考えたためです。 私の原点は、日本のゲームセンターや、海外コミュニティの小さな講堂やコミュニティセンターで、まだ小規模なトーナメントをサポートしていた時代にあります。 アーケード筐体を自ら運び込み、「鉄拳もぜひ遊んでみてほしい」と声をかけながら、目の前の参加者と向き合った日々。 あの場で交わした言葉や空気が、私という開発者の核を形作りました。 時代が変化しても、あの経験が自分の中心にあります。 そしてトーナメントシーンが大きく成長した後も、皆さんは旧知の友人のように私に声をかけ、会場で対戦したり、バーで『一緒に飲もう』と誘ってくれました。 それらもまた、大切な思い出です。 ここ数年間、私生活においては友人達との死別があり、仕事においては、私が尊敬する多くの先輩方の引退や逝去に触れてきました。 そうした出来事の積み重ねが、私に『開発者として残された時間』について考える契機を与えました。 その過程で、私がもう一人の父親のように敬愛する久夛良木健さんにも相談し、貴重な助言と励ましのお言葉をいただきました。 この言葉もまた、今回の決断を静かに後押しするものとなりました。 そして、この4〜5年をかけて私の担ってきたすべての業務やストーリーや世界観、そして責務をチームに段階的に引き継ぎ、今日に至ります。 振り返れば、VR作品（サマーレッスンなど）や『ポッ拳』、ソウルキャリバーシリーズをはじめ、自社他社問わず数多くのプロジェクトに携わる機会に恵まれました。 いずれのプロジェクトも新しい発見と学びに満ち、かけがえのない経験となりました。 これまで支えてくださった皆様、世界中のコミュニティの皆様、そして長年ともに歩んできた仲間たちに深く感謝申し上げます。 次の歩みについては、改めて皆様にお伝えいたします。 これからも、どうぞよろしくお願いいたします。 +あとがき 2025年末をもって退職致しますが、2026年1月末のTWT FINALには顔を出してほしいと会社からお願いされていることもあり、FINALにはゲストとして顔を出すと思います。 これまで30年間『いつかやるよ』と言い続けてやってこなかったトーナメントイベントでのDJですが、その代わりとして“最初で最後のDJ風60分ノンストップ鉄拳ミックス（私による初編集DJ mix）”も、今回のポストに合わせて公開します。 ‘TEKKEN: A 30-Year Journey – Harada’s Final Mix’ by Katsuhiro Harada 1 is on #SoundCloud# 様々な思い出が蘇ります。改めて皆さんありがとうございました。 2025年12月8日 - 鉄拳30周年最終日 - Katsuhiro Harada

🗡️What's Your Favorite Olivier's Skill Cutscene? 🗡️ Olivier’s sword appears everywhere! (´･ω･` )つ━☆・*。🗡️ Which Olivier skill cutscene is your favorite? Share your pick and tell us your special reason in the comments below! ⬇️⬇️Vote NOW!⬇️⬇️ 📅 Event Period Until November 25, 2025 (Tue), 2:59 PM (UTC) 📝 How to Participate ① Subscribe to the official BrownDust2 YouTube channel and like the event post ② Vote for your favorite Olivier Skill Cutscene! 👉 Don’t forget to tell us in the comments WHY you picked your favorite! 🎲 Mission If the total number of votes exceeds 20,000… 🎁 Reward 3 Draw Tickets (for everyone!) 🎉 Results Announcement November 26, 2025 ※ The total vote count will be calculated across all regions. Thank you!

It’s 2 for $20 on all lipsticks today on for day 5 of my 12 Days of Christmas event! 🎄💄 Today’s promo is also available at @ultabeauty stores nationwide, today only! @kyliecosmetics

2.3x faster. Ran @UnslothAI Qwen3.6 MTP variants on a DGX Spark (UD-Q6_K_XL): > 27B → 27B MTP: 8.1 → 18.65 t/s (2.3x faster) > 35B A3B → 35B A3B MTP: 56.91 → 66.52 t/s (+17%) The 27B dense model more than doubled throughput from MTP alone. Free speed is free speed.

it's my annual Valentine's Day sale TOMORROW!! Starting at 9am pst Friday, it's 2 for $20 on all lip singles, and for the first time ever I'm including my HIGH GLOSS shades in the promo! So excited for this..

Intel’s EMIB Packaging Is Growing Rapidly — Silicon Capacitors Are Taking Off Too Silicon capacitors are poised for explosive growth in the AI semiconductor space. Intel has been found to be planning a large-scale adoption of silicon capacitors starting next year, in order to enhance the performance of its in-house 2.5D packaging technology, “EMIB.” The most clearly visible source of demand is Google. Google plans to launch its next-generation AI accelerator, “v8e,” in the second half of next year, and has adopted an EMIB substrate with embedded silicon capacitors for that chip. With other Big Tech companies such as Amazon also currently applying EMIB, analysts say demand could increase sharply. According to industry sources on the 27th, Intel plans to apply silicon capacitors to its 2.5D packaging starting next year. Intel Adopts “Silicon Capacitors” for 2.5D Packaging… Google AI Chip Gets First Application 2.5D is an advanced packaging technology that inserts a thin-film interposer between the semiconductor and the substrate. Because it can connect circuits at higher density compared with conventional packaging that uses only a substrate, demand is rising in the AI and HPC fields. To improve cost efficiency in 2.5D packaging, Intel devised its own technology called EMIB. Rather than using a broad, spread-out interposer, EMIB connects chip to chip using a small silicon bridge. Since bridges only need to be placed where chip-to-chip connections are required, chips can be arranged more flexibly and efficiently. Recently, EMIB has been drawing attention as an alternative to TSMC, which had been leading the existing 2.5D packaging market. This is because TSMC’s 2.5D packaging capacity is suffering from a supply shortage amid the rapid development of the AI industry. Indeed, global Big Tech player Google is also paying attention to EMIB. Google has decided to adopt EMIB for its in-house AI semiconductor “v8e,” which it plans to launch in the second half of next year. Under this structure, TSMC handles chip mass production, MediaTek handles design and manufacturing support, and Intel handles packaging. However, there have been concerns that EMIB is gradually showing limitations in providing stable power supply for AI semiconductors, which consume large amounts of power. Accordingly, Intel plans to introduce new technologies such as silicon capacitors and through-silicon vias (TSV) to ensure stable packaging for the v8e. A capacitor is a component that stores and releases electricity in an electronic circuit. In the case of silicon capacitors, their resistance (ESL/ESR) is more than 100 times lower than that of conventional multilayer ceramic capacitors (MLCC), minimizing the signal loss that occurs in high-performance semiconductors. They can also be designed in an ultra-thin structure based on a silicon wafer, enabling high-density integration. A semiconductor industry official explained, “Because the voltage drop (the phenomenon of voltage decreasing) that occurs in the high-frequency region within AI chips is difficult to solve with MLCC, we understand that Intel is adopting silicon capacitors as a solution,” adding, “The relevant supply chain is now in place, and mass production is set to begin in earnest next year.” EMIB-T Is Already on a Growth Trajectory — The Related Ecosystem and Market Are Expanding Together Intel has also inserted TSVs, which serve as power-delivery channels, into the silicon bridge. The key point is that by using TSVs to shorten the power-delivery path between the substrate and the chip, Intel has improved power efficiency and signal integrity. Intel calls this “EMIB-T.” The industry expects the EMIB-T and silicon capacitor markets to grow rapidly. This is because Japan’s Ibiden — one of the major companies that mass-produces semiconductor substrates for EMIB-T — is aggressively pursuing capital investment. Previously, Ibiden had planned to build its Kawashima (Gama) plant in Gifu Prefecture as a substrate plant for Intel CPUs. However, it postponed that schedule and decided in the first half of this year to officially convert the Gama plant into a mass-production line for EMIB-T substrates. The investment is 220 billion yen (about KRW 2.1 trillion). In its recent earnings announcement, Ibiden stated, “Operation of the Gama plant will begin in 2027 and enter full-scale mass production in 2028,” adding, “EMIB-T substrate capacity is currently far short of demand. However, adding further capacity is quite difficult, so we are discussing options with our customers.” A semiconductor industry official explained, “Ibiden’s EMIB-T-dedicated line is being built with most of the investment coming from customers such as Google, Amazon, and Intel,” adding, “This demonstrates that AI semiconductors based on EMIB-T will grow significantly going forward, and silicon capacitors are likely to expand alongside them.”