Trendforce reports 4Q DRAM contract prices are expected to rise about 20% qoq. The projected increase marks a sharp slowdown from 80% in 2Q and 40% in 3Q, reflecting a higher comparison base, weakening end-market purchasing power, and price ceilings under LTAs gradually taking effect, citing Commercial Times

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TrendForce sees CapEx from the world’s nine leading CSPs to surge 106% YoY to $957 billion in 2026. In 2027, this figure is expected to surpass $1.5 trillion, representing a further 60% YoY increase. Total server market revenue to surpass $1 trillion for the first time in 2027, while AI server revenue is projected to surge by more than 90% YoY to nearly $920 billion. $DELL $HPE $SMCI $GOOGL $AMZN $META $MSFT

TrendForce now expects combined capital spending by nine major cloud providers to exceed $1.5 trillion in 2027, up 60% year over year. It previously forecast 50% growth. The firm says higher server and component prices are driving up spending. Some suppliers also require advance payments to secure parts, bringing cash outlays forward. It expects AI server shipments to rise nearly 36% in 2027, with revenue growing more than 90% to almost $920 billion, helped by higher average selling prices.

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TrendForce maps the companies supplying bonding equipment Hybrid bonding is already used in niche applications. Soon, it’ll take over many facets of advanced packaging $BESI and ASMPT ( have the broadest exposure, with Hanmi (042700.KS) and Hanwha Semitech competing in memory TCB EV Group and Tokyo Electron (8035.T) occupy the wafer-to-wafer bonding side, while Shibaura Mechatronics (6590.T) competes with Besi and ASMPT in die-to-wafer hybrid bonding SUSS ( appears across both hybrid-bonding formats for memory