Discovered Materials' Akash Ramdas argues the next chip scaling frontier isn't smaller transistors, it's how many you can stack on top of each other: HBM is already 12 high DRAM going to 16 high "We're starting to do this thing where we're taking a logic chip and then putting memory on top of it. That's where materials can make a difference, because now you're actually thermally limited. The thing that's preventing your scaling is no longer how small is your transistor, but how many transistors can you put on top of each other?" "The high bandwidth memory you'd have seen is a stack of dynamic random access memory. It's a 12-high dynamic random access memory stack right now. One of the roadmaps is to make this even higher, 16-high, and this is how you deal with memory bottlenecks in inference or training." "The next stage of that is putting that HBM on top of a logic die. Both these technologies are going to be partially enabled by new materials."