Haha yea - the Huawei approach really is kinda like warmholes (wait until the journalists get a hold of that comparison).
Just like warmholes connect two 3D points in a 4th dimension and dramatically reduce travel time, Huawei's approach does that in 2D/3D.
No, this isn't the same thing as memory stacking (although there are similarities when it comes to bonding technology) - they have to be able to very precisely align many many tiny traces between the two layers (create the warmholes!!) for this to work.