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NEWS
@NEWS2082680
Live insights on semi and AI, tailored for global investors and industry players. Hosted by @trendforce, streaming weekdays and available on LinkedIn and FB.
参加 July 2025
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🚀 #Samsung# is reportedly working on next-gen mobile #HBM# packaging using ultra-high-aspect-ratio copper pillars and FOWLP, with bandwidth gains said to reach 15%–30%.💡More: 🔗
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