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Micron# and #
Samsung# both stack #
HBM# directly on processors: Micron's #
vHBM# keeps a base die and targets 2028, while Samsung's zHBM drops the 2.5D interposer, with commercialization eyed for about 2029 and as early as 2028. ๐กMore: ๐ $MU $SSNLF