ASIC Shipments to Surpass GPUs in 2027
DIGITIMES expects ASIC shipments to surpass GPUs in 2027, driven by $GOOG, $AMZN, and Huawei, while Nvidia and Google emerge as the two dominant forces in high-end AI accelerators
As $TSM, $ASX, and Amkor expand advanced packaging capacity, the main supply constraints are shifting toward ABF substrates, T-glass, high-layer-count PCBs, and HBM
ABF substrates and T-glass are expected to remain in shortage through 2027–2028, prompting major capacity expansions from Ibiden, Unimicron, Kinsus, SEMCO, Shinko, Nittobo, and others
PCB requirements are also becoming far more demanding, with AI server boards moving from 12–20 layers toward 40–50 layers, while new capacity can take 2–3 years to build and qualify
The result is a supply-chain race in which AI accelerator companies increasingly need to secure capacity early, qualify new suppliers, or directly invest in their supply chains
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