TSMC's CoWoS Bottlenecks Is What Makes $INTC a Much Attractive Option For Fabless Customers Intel is reportedly poaching more orders from TSMC (2330) . According to South Korean media reports, SK Hynix, a major South Korean memory manufacturer, originally used TSMC's CoWoS advanced packaging technology for the integration of AI chips and high-bandwidth memory (HBM). However, due to insufficient supply of TSMC's CoWoS capacity, SK Hynix intends to adopt Intel's EMIB advanced packaging technology. Intel has recently been vying for orders from TSMC. Foreign media recently revealed that Apple intends to outsource some of its self-developed processors to Intel, breaking TSMC's decade-long monopoly on Apple's chip manufacturing, shocking the industry. Now, Intel is poaching TSMC's advanced packaging business, essentially launching a full-scale war with TSMC in the consumer electronics and AI fields, highlighting Intel CEO Lip-Bu Tan's ambition to aggressively enter the advanced process foundry and advanced packaging sectors. South Korean media analysis suggests that the negotiations between SK Hynix and Intel are in the best interests of both parties. TSMC is facing a severe shortage of advanced packaging capacity for its CoWoS system, leading many major tech companies to focus on Intel's EMIB as a promising alternative. SK Hynix can improve its yield and reliability through this, while Intel can significantly expand its advanced packaging business. Industry insiders say that Intel is actively promoting its EMIB technology to SK Hynix and major OSAT companies. In the medium to long term, Intel's EMIB is expected to be integrated into the 2.5D packaging supply chain for AI accelerators. Intel plans to achieve eight to ten times the size of the photomask composite this year, providing the highest density computing power at a lower cost. The EMIB 2.5D solution is further divided into the EMIB-M version, which uses MIM capacitors in the silicon bridge to enhance power delivery, and the EMIB-T version, which incorporates silicon through-hole technology to support design conversion from other packaging technologies and meet future high-bandwidth memory requirements.