NEWS(@NEWS2082680):🚀 #Samsung is reportedly working on next-gen mobile #HBM packaging using ultra-high-aspect-ratio copper pillars and FOWLP, with bandwidth gains said to reach 15%

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NEWS@NEWS2082680

2026.05.15 08:00

🚀 #Samsung# is reportedly working on next-gen mobile #HBM# packaging using ultra-high-aspect-ratio copper pillars and FOWLP, with bandwidth gains said to reach 15%–30%.💡More: 🔗

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