Digital Infrastructure World (DIW) will take place February 3–4, 2027, in San Jose, California. As an OCP co-located event, DIW will unite semiconductor and systems companies, networking, power and cooling innovators, hyperscalers, cloud and enterprise leaders, colocation providers, EPCs, utilities, architects, engineers, and data center operators in one collaborative forum designed to accelerate the future of AI infrastructure. More than another industry event, DIW is an opportunity to extend the collaboration that defines OCP by bringing together every organization shaping AI infrastructure—from the chip to the grid. We encourage every OCP member organization to get involved: -Speak – Share your technical expertise, lessons learned, and vision through conference sessions and panels. -Sponsor or Exhibit – Showcase your innovations while connecting with senior decision-makers from across the digital infrastructure ecosystem. *OCP Member discount available* -Attend – Collaborate with peers spanning silicon, systems, networking, power, cooling, cloud, and data centers. *OCP Member discount available* Your participation is more than supporting an event—it's extending the impact of the Open Compute Project and ensuring the principles of openness, collaboration, and innovation continue to guide the future of AI infrastructure. Call for presentations ends today, August 21, 2026! Learn more, register, explore sponsorships and submit here: