TSMC is working hard to maintain its lead over Samsung and Intel, media report, by already preparing for 1nm production at Fab 20 in the Hsinchu Science Park with a 4-phase project (each phase is a new production line). -Fab 20 the vital sub-2nm fab. Phase 1 (P1) and P2 will do 2nm, P3 will do 2nm and A14, with room in P4 for A10 (1nm). The project is already in the hands of its R&D ‘One Team’. -Fab 18 P9 (Tainan) will do 2nm back-end and 3/5nm TSV, with equipment move-in in Q1 2027 and scale up to 25,000 wafers-per-month (wpm) -Fab 22 (Kaohsiung) main 2nm fab, 6 phases. P1 & P2 each 25,000wpm, P3 just started equipment move-in for 2nm, A16; P4 under construction, for N2, A16. -Fab 22 (STSP) P7 construction to start early-2027, will do 2nm and below processes. Has reserved space for future P8 and P9. -Fab 25 (CTSP, Taichung) will host 4-phases for A14, A13, A12 processes, with P1 already under construction, with P2 construction to begin soon, and P3 & P4 already in planning. In advanced packaging: -AP6 plant is expected to reach 10,000 wafers per month capacity by the 3rd quarter, and ramp up phase 3 for CoWoS, SoIC and InFO as well. (Hsinchu) -AP5B plant construction nearly finished, will focus on CoWoS (Taichung) -AP7 plant will be TSMC’s biggest advanced packaging campus, with P1 already packaging Apple chips with WMCM (Wafer-Level Multi-Chip Module) P2 nearly done, with equipment move-in in July, for SoIC for Nvidia. Planning for P3-P7 already underway and will support SoIC and CoPoS. (Chiayi) -AP8 will do CoWoS, with monthly capacity to exceed 40,000 wafers by end-2026, and planning for P2, P3 already started. (Tainan) $TSM $INTC $SSNLF #semiconductors# #semiconductor#