Chad Wallace(@siliconcodesign):Why optical testing could become one of the biggest bottlenecks in CPO manufacturing Unlike traditional semiconductor testing, CPO requires coordination between electrical ATE, optical instrumentation, and precision mechanical alignment. Any imperfections in fully assembled units become costly to scrap, making known-good die screening critical early on.

Chad Wallace

@siliconcodesign

Deep-Tech Semiconductor Analyst, MSEE @JohnsHopkins. Expert-driven system architecture deep-dives of AI datacenter hardware at

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Chad Wallace@siliconcodesign

2026.10.17 12:00

Why optical testing could become one of the biggest bottlenecks in CPO manufacturing Unlike traditional semiconductor testing, CPO requires coordination between electrical ATE, optical instrumentation, and precision mechanical alignment. Any imperfections in fully assembled units become costly to scrap, making known-good die screening critical early on.

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