MojoTrick(@MojoTricks):Micron just laid out its AI memory roadmap through 2030. Token efficiency = Bandwidth + Energy Efficiency + Capacity • HBM (JEDEC + Custom) → HBM4 to HBM6 • vHBM (Vertical 3D HBM) starts 2028 • vEIM (Vertical Edge Inference Memory) targets 2TB/s & <1pJ/bit Vertical stacking is coming. Memory wall is real. #HBM #Micron #AI #Semiconductors #vHBM

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MojoTrick@MojoTricks

2026.10.22 07:31

Micron just laid out its AI memory roadmap through 2030. Token efficiency = Bandwidth + Energy Efficiency + Capacity • HBM (JEDEC + Custom) → HBM4 to HBM6 • vHBM (Vertical 3D HBM) starts 2028 • vEIM (Vertical Edge Inference Memory) targets 2TB/s & <1pJ/bit Vertical stacking is coming. Memory wall is real. #HBM# #Micron# #AI# #Semiconductors# #vHBM#