Semiconductor Engineering
@SemiEngineering
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加入 September 2013
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Thermally induced warpage, caused by differences in the rate at which materials expand when heated, is becoming problematic in large chips/packages.
#semiconductor# #warpage# #NTE# #CTE#
@mcgc_en @AmkorTechnology @brewerscience
#advancedpackging# @Synopsys
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