Dan Nystedt(@dnystedt):Rumor: Intel Malaysia took over some advanced packaging for TSMC due to a surge in orders for CoWoS packaging by a major mutual client, media report, adding ASE, Unimicron, Gudeng Precision and others are also expected to benefit from the move. TSMC is expected to ship more advanced chips as the packaging bottleneck eases. $INTC $TSM $ASX $GOOGL $NVDA #semiconductors

Dan Nystedt

@dnystedt

Former journalist, now financial analyst. Based in Taipei. Tweet mainly about semiconductors and Taiwan. Not investment advice. Views are my own.

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Dan Nystedt@dnystedt

2026.08.18 23:45

Rumor: Intel Malaysia took over some advanced packaging for TSMC due to a surge in orders for CoWoS packaging by a major mutual client, media report, adding ASE, Unimicron, Gudeng Precision and others are also expected to benefit from the move. TSMC is expected to ship more advanced chips as the packaging bottleneck eases. $INTC $TSM $ASX $GOOGL $NVDA #semiconductors#