Dan Nystedt(@dnystedt):Intel is in talks with Taiwan’s AUO for advanced packaging aimed at CPO (co-packaged optics), due to AUO’s work on Micro LED technology, media report, a project that also uses glass substrates. The two may also work together on advanced packaging for high-density compute. $INTC #AUO #semiconductors

Dan Nystedt

@dnystedt

Former journalist, now financial analyst. Based in Taipei. Tweet mainly about semiconductors and Taiwan. Not investment advice. Views are my own.

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Dan Nystedt@dnystedt

2026.09.20 23:35

Intel is in talks with Taiwan’s AUO for advanced packaging aimed at CPO (co-packaged optics), due to AUO’s work on Micro LED technology, media report, a project that also uses glass substrates. The two may also work together on advanced packaging for high-density compute. $INTC #AUO# #semiconductors#