🚨The launch of the day!! @Xiaomi just unveiled the Xring O100 (玄戒O100) - first dedicated high-bandwidth AI accelerator for edge large models - Vertically stacks a 6nm NPU compute wafer with dual high-speed DRAM memory wafers (Wafer-on-Wafer 3D stacking). - Uses advanced Hybrid Bonding instead of conventional micro-bumps. •- Bonding pitch shrinks from ~50 μm all the way to 1.4 μm. - Creates 2.58 million high-speed physical pathways (TSV diameter just 0.7 μm). - Face-to-Face metal-layer direct connections open ultra-short “data wells” straight into the compute cores. - Paired with Xiaomi’s self-designed high-bandwidth matrix bus (HB-Matrix) and 14-core NPU, data flows between the NPUs and memory at extreme speed with dynamic topology switching (ring for prefill, broadcast for decode). - 1.22 TB/s near-memory bandwidth — 16× a flagship phone’s LPDDR5X - Up to 330 tokens/s edge inference (3B model in Xiaomi lab tests) - Designed for on-device LLMs for following Applications: - Smartphones - PCs - Robots - Xiaomi cars / intelligent driving systems - AI Cube prototype (paired with Xring O3 + D100), for models up to 120B parameters locally at up to 150W sustained 🗓️ The chip has completed silicon validation and is scheduled for commercial use in 2027. #Xiaomi# #XRing# #DRAM#