Re: the rumor that NVIDIA cut orders One thing I’ve been able to confirm is that Rubin has been delayed again. I’m told motherboard warpage caused the latest delay and that the HBM issue was resolved in October. (As it happens, Korean media reported today that SK hynix’s HBM4 yield had reached 70%.) As a result, volume shipments of Rubin have slipped to 2027, and I’m told NVIDIA has increased its Blackwell orders in the meantime. Since posting about the rumored order cuts, I’ve spoken with several funds and supply chain contacts. One rumor making the rounds is that CCL orders were cut by 30%. One source I spoke with said that claim was false. I hope this helps. Thanks.

South Korean media report that JNTC is entering the market for glass platters used in hard disk drives (HDDs), a market long monopolized by Japan’s HOYA. JNTC has secured the capacity to produce roughly 120 million to 170 million platters and plans to supply Seagate. The two companies have been working together for years to bring JNTC’s glass platters into Seagate’s supply chain. JNTC plans to prioritize Seagate’s demand through 2030, then expand supply to Western Digital and Toshiba. JNTC expects the business to generate hundreds of millions of dollars in annual revenue. For context, the company’s total revenue last year was less than $200 million. JNTC said it expects HDD glass platter sales to start showing up in its results in the first quarter of next year. Current estimates suggest HOYA will eventually supply about 60% of Seagate’s glass platters, with JNTC supplying the remaining 40%. JNTC’s entry would mark the first crack in HOYA’s monopoly.

Korean media report that LG Chem has begun developing materials for mass reflow molded underfill (MR-MUF), a key process in high-bandwidth memory (HBM) manufacturing. The company has reportedly made significant technical progress in developing non-conductive film (NCF), with promising results in recent evaluations, and is now expanding its work to include MR-MUF materials. Samsung Electronics currently sources most of its NCF from Japan’s Resonac, while SK hynix sources its MR-MUF materials from another Japanese supplier, Namics. According to the reports, if LG Chem’s development efforts succeed, HBM manufacturers such as Samsung Electronics and SK hynix could reduce their reliance on Japanese materials and diversify their supply chains.

According to Korean media reports, Samsung Electro-Mechanics selected the equipment for its glass substrate production line last month and sent letters of intent (LOIs) to the suppliers. Deliveries are scheduled to begin in the second half of 2027, and the company has asked suppliers to install the equipment in Pyeongtaek, Gyeonggi Province. The “one-pass” line will be used primarily for pilot production. If the pilot run goes well, Samsung Electro-Mechanics is expected to place much larger equipment orders. The equipment suppliers include LPKF, Taesung, Cymechs, SD Optics, Innometry, Techvalley, and HB Technology. Samsung Electro-Mechanics aims to begin mass production of glass substrates in 2028. Broadcom is seen as the likely customer.

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